Tablet PC

At a time when the market demand for electronic products is becoming lighter, lighter and more portable, tablet PCs, which combine the functions of mobile phones and laptops, are in increasing demand. Tablet PCs have larger displays than mobile phones, and the multifunctionality requires a high-performance processor, which expands the need for heat dissipation.

Thermally conductive interface materials that can be applied to tablet PCs include:

① Bornsun Industry has high thermal conductivity and low thermal resistance thermally conductive silicone grease (BN-GC3091, BN-GC4021, BN-GC5506,) which is applied to scenarios with high thermal conductivity and thin thickness requirements. It can be applied to the gap between CPU or graphics card and heat sink to enhance the thermal conductivity efficiency.

② Thermal Conductive Spacer (BN-FS series) can fill the gap between the heat generating device or the whole PCB board and the metal casing or heat sink, which can effectively transfer heat and dissipate heat, and safeguard the efficiency of the heat generating electronic components. Its hardness, oil release rate, volatility, carrier and compression rate can be flexibly designed according to customer needs.

③ Thermally conductive gel (BN-TG350, BN-TG350-60) compression stress is low, the minimum application gap can be as low as 0.05mm, low thermal resistance, to meet the tablet PC 8-core chip of high-power heat dissipation needs. As a thermal interface material with high thermal conductivity, thermal conductive gel is mainly used to fill the micro-gaps and the uneven holes on the surface of the material when two materials are joined or contacted, to exclude the air therein, and to establish an effective heat conduction channel between the electronic components and the heat sink, which reduces the contact thermal resistance and enables the heat sink to fully play its role.