Home Game Consoles

There is a wide variety of games available in the market today with rich gameplay, thus there is an urgent need to upgrade the performance of gaming consoles. From display clarity, high-quality audio output, and high-performance processors and graphics cards to process game images and data. The upgraded performance of gaming consoles has brought about a higher demand for heat dissipation.

Thermally conductive interface materials that can be applied to home gaming consoles include:

① Thermally conductive silicone grease (BN-GC3091, BN-GC4021, BN-GC5506) can be used to dissipate heat on CPU chips. It can be applied directly or stencil/screen printed on the surface of the target device; it can fully wet the surface of the target component to form a very low thermal resistance interface.

② Liquid metal (BN-GC1026LM) can be used for the gap between the CPU case and heat sink, liquid metal up to nano-scale particles determine that it has a better gap-filling ability, better thermal conductivity, to meet the needs of game consoles working with a large amount of heat dissipation.

③Thermal conductive gel (BN-TG350-4, BN-TG350-60) can fill the gap between the chip and the heat sink to improve the heat dissipation efficiency. Thermal conductive gel presents a paste state, which will not lead to deformation of micro devices inside electronic products.