Notebook computers

Notebook computers from large volume, high weight, poor stability all the way to today's thin and lightweight, powerful, not only to promote the development of chips and various types of accessory technology, bringing the miniaturisation of chips and accessories, highly centralised, effective, and at the same time, the thermal conductivity of the thermal conductivity of the material, the reliability of the requirements of a higher level. Thin and light notebook computer body internal space is small, the use of PC accessories and layout of the special, if then equipped with a high configuration of the processor and chip, the heat dissipation difficulty will be greatly enhanced, then choose a performance of the thermal conductivity of the material is particularly important.

Thermally conductive interface materials that can be applied on notebook computers include:

① Thermally conductive spacer (BN-FS250, BN-FS300, BN-FS500) can fill the gap between the heat-generating device or the entire PCB board and the metal casing or heat sink, effectively transferring heat to dissipate heat and safeguarding the efficiency of heat-generating electronic components.

②Thermally conductive silicone grease can fully wet the surface of the target component, forming a very low thermal resistance interface. Therefore, under the same thermal conductivity, thermal grease (BN-GC4021L, BN-GC5506) will have better thermal conductivity. Through the combination of "fan - heat pipe - heat sink - thermally conductive grease", the CPU graphics card on the motherboard evacuates heat through the heat sink.

③ Thermal conductive phase change film (BN-PM1050) can be used for heat transfer between the chip or graphics card and the heat sink. The thermally conductive phase change film transforms from solid to liquid when it reaches the phase change temperature, and is used to fill the gap between the heat-generating device and the heat sink, which results in low thermal resistance to form an interface with good thermal conductivity.

④ Liquid metal (BN-GC1026LM) can be used for thermal conductivity at notebook chips with high heat generation. It is a solvent-free, high-fluidity thermal conductivity material with a thermal conductivity of up to 20~30W/m-K. It can obtain a very thin contact interface as well as a very low thermal resistance, and is safe and non-toxic.